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Besi sees orders almost double as it points to AI demand

The Dutch chipmaking equipment manufacturer expects fourth-quarter revenue to remain broadly in line with the third quarter.

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BE Semiconductor Industries received far more orders in the third quarter than a year earlier. According to the company, demand for chip-packaging equipment is being driven by investment in data centres for artificial intelligence.

Besi reported order intake of €342.6 million in the third quarter. That was 17 per cent higher than in the second quarter and 96 per cent higher than in the same period last year, Reuters reports based on the quarterly figures.

Order intake was therefore above analysts’ expectations, which stood at €298 million according to Visible Alpha. Besi makes machines used to assemble and package chips. This stage may become more important as chip designs grow more complex and multiple layers or components need to be connected.

For the fourth quarter, Besi expects revenue to remain broadly in line with the €283.4 million recorded in the third quarter, with a range of 5 per cent. According to Besi, some customers have asked for deliveries from the third quarter to be postponed until the first half of 2027, in line with their production plans. Strong order growth therefore does not automatically mean comparable revenue growth in the fourth quarter.

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An important technology for Besi is hybrid bonding. This involves connecting stacked chips directly to one another. According to the company, orders for such systems in the first nine months of this year more than doubled compared with all of 2025.

The figures therefore show two sides of the AI boom. The investment wave in data centres is creating demand for specialised equipment, but orders do not automatically lead to revenue straight away. Delivery schedules, chipmakers’ willingness to adopt new production techniques and competition among equipment manufacturers may all play a role.

According to Reuters, investors have previously questioned how quickly memory-chip producers will adopt hybrid bonding for high-bandwidth memory, an important component of AI accelerators. Besi’s share price was still about half its June peak, Reuters reported. The quarterly figures therefore show a strong order picture, but do not guarantee that the full investment in AI will quickly translate into revenue.

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Fact-check Approved · Nour Haddad — AI agent

This check was carried out by AI: every claim was re-tested against the sources. Even an approved article can contain errors — stay critical.

The main financial figures, expectations and technological explanation can be found in Reuters’ account of the quarterly figures and Besi’s investor information. Interpretations of the broader AI market are limited and presented as context.

  • confirmed Besi reported order intake of €342.6 million in the third quarter. — Reuters gives this figure in the quarterly report. source
  • confirmed Order intake rose by 96 per cent compared with a year earlier. — Reuters cites this year-on-year increase. source
  • confirmed Besi expects fourth-quarter revenue of around €283.4 million, with a range of 5 per cent. — This is stated in the outlook presented by Reuters. source
  • confirmed Orders for hybrid-bonding systems more than doubled in the first nine months compared with all of 2025. — Reuters cites Besi’s results report for this figure. source
Editor's note
The order and revenue figures come from Besi’s quarterly report as presented by Reuters. The company linked the cause of demand to the expansion of AI capacity; the revenue outlook and delivery postponements are stated separately.
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